以氯化铜水溶液作电解液,在发光多孔硅薄膜表面上电沉积铜.SEM观测和计算机图像处理结果表明:电沉积之后,在多孔硅薄膜上形成了一些或实心或中空的等边三角形铜微晶,沉积后的多孔硅薄膜的分形维数从2.608降为2.252,其表面由粗糙变为光滑.与物理方法制作相比,这是一种机械强度和导电性能都更加良好的多孔硅薄膜.

Microcrystals of metallic copper were electrochemically deposited onto the surface of porous silicon films in the aqueous electrolyte of copper(II) chloride.The microstructures of electrochemically deposited copper microcrystals on the porous silicon films were characterized by using scanning electron microscopy.The results have demonstrated that both center-hollowed and center-solid equilateral triangles in the sizes of several micrometers can be formed on the smooth bed of copper microcrystals.As the deposition duration increased from 0 to 28 hours,the fractal dimensions of the porous silicon was decreased from 2.608 to 2.252,suggesting that the electrochemical deposition can smooth the rough surface of porous silicon films.Compared to the physically deposited metallic films on porous silicon,the electrochemically deposited ones have larger mechanical strength and better electrical conductivity.