以γ-氨丙基三乙氧基硅烷(KH-550)为先驱体,应用溶胶-凝胶技术在织物表面形成一层凝胶薄膜.由于该薄膜含有氨基和羟基等活性基团,能与钯离子起配位络合作用,阻止钯粒子的团聚,使钯以较高的活性完成织物化学镀.扫描探针显微镜(SPM)及扫描电子显微镜(SEM)观察了施镀前后织物的表面形态.与传统的前处理相比,无需SnCl2敏化,减少污染,缩短工艺流程,降低钯盐用量.

Using KH-550 as precursors,gel thin films were formed on fabric by sol-gel method.By complexed with palladium ions due to the presences of amido and hydroxide in the gel thin films,the aggregation of palladium particles was inhibited.Therefore,Palladium could exhibit better catalytic activity in the process of electroless plating.The surface morphology of fabric was observed by SPM and SEM.Campared with the traditional pretreatment process,no SnCl2 was needed.This method reduced pollution,shortened process flow and reduced the amount of noble metals.