芯片铜互连研究及进展
收稿日期: 2020-02-12
修回日期: 2020-03-09
网络出版日期: 2020-03-10
基金资助
国家自然科学基金项目资助(21972118);国家自然科学基金项目资助(21827802)
Research Progresses of Copper Interconnection in Chips
Received date: 2020-02-12
Revised date: 2020-03-09
Online published: 2020-03-10
金磊 , 杨家强 , 杨防祖 , 詹东平 , 田中群 , 周绍民 . 芯片铜互连研究及进展[J]. 电化学, 2020 , 26(4) : 521 -530 . DOI: 10.13208/j.electrochem.200212
In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.
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