本文通过加入氯化镍解决了作者实验室之前开发的新型氯化胆碱（ChCl）无氰浸金液不适用于中磷镍基底上的问题. 氯化镍的加入不会对镀速产生明显影响，500 mg·L^-1的六水合氯化镍可以有效缓解浸金液对镍基底的过度腐蚀，并能改善镀金层的表面质量. 改良后的氯化胆碱体系镀液对中磷镍基底有良好的适用性，同时对所用的添加剂镍离子具有较高的承载能力（六水合氯化镍2000 mg·L^-1），因此该镀液体系具备了应用于工业生产的潜力.

The nickel ions (Ni²⁺) were introduced into choline chloride (ChCl) cyanide free immersion gold solution to improve the surface quality of electrodeposition on medium-phosphorus nickel substrate. The addition of Ni²⁺ had no significant impact on the plating speed. However, the hyperactive corrosion of nickel substrate could be effectively alleviated by the addition of 500 mg·L^-1 NiCl₂·6H₂O, and the surface morphology of gold coating could be greatly improved. The choline chloride bath has great potential for industrial production due to its high Ni²⁺ carrying capacity (2000 mg·L^-1) and superior applicability to medium-phosphorus nickel substrate.