CH_3OH-H_2O体系化学镀铜Mg_(1.85)Mm_(0.15)Ni合金的抗腐蚀性能研究

电化学（中英文） ›› 2003, Vol. 9 ›› Issue (2): 196-202.

CH_3OH-H_2O体系化学镀铜Mg_(1.85)Mm_(0.15)Ni合金的抗腐蚀性能研究

杨化滨,张海昌,孙华,王晓丹,周作祥

南开大学能源材料化学研究所,南开大学能源材料化学研究所,南开大学能源材料化学研究所,南开大学能源材料化学研究所,南开大学能源材料化学研究所天津300071 ,天津300071 ,天津300071 ,天津300071 ,天津300071

收稿日期:2003-05-28 修回日期:2003-05-28 出版日期:2003-05-28 发布日期:2003-05-28

Corrosion Behavior of Mg_(1.85)Mm_(0.15)Ni Hydrogen Storage Alloy Modified by Electroless Cu in CH_3OH·H_2O Solutions

YANG Hua_bin*,ZHANG Hai_chang, SUN Hua, WANG Xiao_dan, ZHOU Zuo_xiang

(College of Chemistry Institute of New Energy Material Chemistry, Nankai University, Tianjin 300071,China)

Received:2003-05-28 Revised:2003-05-28 Published:2003-05-28 Online:2003-05-28

摘要/Abstract

摘要： 　采用稳态极化曲线法和交流阻抗法研究了在甲醇水不同含量镀液中化学镀铜的Mg1.85Mm0.15Ni(Mm∶富铈混合稀土)储氢合金于强碱性溶液中的抗腐蚀性能.结果表明,对甲醇＿水体系化学镀铜,合金的抗腐蚀性可进一步改善.其中以甲醇体积比含量为40%的镀液施镀的抗腐蚀效果最佳.稳态极化曲线测试给出,此时合金的腐蚀电流密度只有5.6mA·cm-2,相应的电化学反应阻抗为22.25Ω·cm2,而原粉的两者之值分别为11.7mA·cm-2和1.99Ω·cm2.

关键词: 镁基储氢合金, 富铈混合稀土, 抗腐蚀性能, 非水体系镀铜

Abstract: The corrosion behavior of the Mg1.85Mm0.15Ni (Mm:Ce_rich mischmetal) alloy modified by electroless Cu coating in different CH3OH_H2O solutions has been investigated by potentiodynamic polarization and electrochemical impedance spectroscopy. These results showed that the corrosion behavior was improved after electroless Cu. The potentiodynamic polarization and electrochemical impedance spectroscopy results showed that the alloy electrode had more promising anti_corrosion behavior after coated in a 40%CH3OH_H2O solution. The values of corrosion current density and electrode reaction resistance were 5.6 mA·cm-2(11.7 mA·cm-2 for uncoated alloy electrode) and 22.25 Ω·cm2 (1.99 Ω·cm2 for the uncoated alloy electrode), respectively.

中图分类号:

TM911

杨化滨, 张海昌, 孙华, 王晓丹, 周作祥. CH_3OH-H_2O体系化学镀铜Mg_(1.85)Mm_(0.15)Ni合金的抗腐蚀性能研究[J]. 电化学（中英文）, 2003, 9(2): 196-202.

YANG Hua_bin, ZHANG Hai_chang, SUN Hua, WANG Xiao_dan, ZHOU Zuo_xiang. Corrosion Behavior of Mg_(1.85)Mm_(0.15)Ni Hydrogen Storage Alloy Modified by Electroless Cu in CH_3OH·H_2O Solutions[J]. Journal of Electrochemistry, 2003, 9(2): 196-202.

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