镍离子对中磷镍基体氯化胆碱无氰浸金表面的改善

doi:10.13208/j.electrochem.170445

电化学（中英文） ›› 2018, Vol. 24 ›› Issue (1): 36-39. doi: 10.13208/j.electrochem.170445

• 电镀与表面精饰近期研究专辑( 哈尔滨工业大学安茂忠教授主编) • 上一篇下一篇

镍离子对中磷镍基体氯化胆碱无氰浸金表面的改善

徐天宇¹，王世颖²，王文昌¹，陈智栋^1*

1.常州大学石油化工学院，江苏常州 213164；2. 常州大学材料科学与工程学院，江苏常州 213164

收稿日期:2017-04-17 修回日期:2017-10-19 出版日期:2018-02-28 发布日期:2017-10-20
通讯作者: 陈智栋 E-mail:zdchen@cczu.edu.cn
基金资助:
国家自然科学基金（No. 51574047、No. 51601020）项目资助

Surface Ehancement of Nickel Ions on Cyanide Free Immersion Gold Deposited from a Chloroauric Acid-Choline Chloride Solution on Medium-Phosphorus Nickel

XU Tian-yu¹，WANG Shi-ying²，WANG Wen-chang¹，CHEN Zhi-dong^1*

1. School of Pertochemical Engineering, Changzhou University, Changzhou, Jiangsu 213164, China; 2.School of Materials Science & Engineering, Changzhou University, Changzhou, Jiangsu 213164, China

Received:2017-04-17 Revised:2017-10-19 Published:2018-02-28 Online:2017-10-20
Contact: CHEN Zhi-dong E-mail:zdchen@cczu.edu.cn

摘要/Abstract

摘要： 本文通过加入氯化镍解决了作者实验室之前开发的新型氯化胆碱（ChCl）无氰浸金液不适用于中磷镍基底上的问题. 氯化镍的加入不会对镀速产生明显影响，500 mg·L^-1的六水合氯化镍可以有效缓解浸金液对镍基底的过度腐蚀，并能改善镀金层的表面质量. 改良后的氯化胆碱体系镀液对中磷镍基底有良好的适用性，同时对所用的添加剂镍离子具有较高的承载能力（六水合氯化镍2000 mg·L^-1），因此该镀液体系具备了应用于工业生产的潜力.

关键词: 置换镀金, 氯化胆碱, 过度腐蚀, 镍离子

Abstract: The nickel ions (Ni²⁺) were introduced into choline chloride (ChCl) cyanide free immersion gold solution to improve the surface quality of electrodeposition on medium-phosphorus nickel substrate. The addition of Ni²⁺ had no significant impact on the plating speed. However, the hyperactive corrosion of nickel substrate could be effectively alleviated by the addition of 500 mg·L^-1 NiCl₂·6H₂O, and the surface morphology of gold coating could be greatly improved. The choline chloride bath has great potential for industrial production due to its high Ni²⁺ carrying capacity (2000 mg·L^-1) and superior applicability to medium-phosphorus nickel substrate.

Key words: non-cyanide, immersion gold, choline chloride, hyperactive corrosion, Ni²⁺

中图分类号:

徐天宇，王世颖，王文昌，陈智栋. 镍离子对中磷镍基体氯化胆碱无氰浸金表面的改善[J]. 电化学（中英文）, 2018, 24(1): 36-39.

XU Tian-yu，WANG Shi-ying，WANG Wen-chang，CHEN Zhi-dong. Surface Ehancement of Nickel Ions on Cyanide Free Immersion Gold Deposited from a Chloroauric Acid-Choline Chloride Solution on Medium-Phosphorus Nickel[J]. Journal of Electrochemistry, 2018, 24(1): 36-39.

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链接本文: https://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.170445

https://electrochem.xmu.edu.cn/CN/Y2018/V24/I1/36

参考文献

[1] Sharma R K, Kaneriya R, Patel S, et al. Microwave integrated circuits fabrication on alumina substrate using pattern up direct electroless nickel and immersion Au plating and study of its properties[J]. Microelectronic Engineering, 2013, 108: 45-49.
[2] Kim J, Myung W R, Jung S B. Effects of aging treatment on mechanical properties of Sn-58Bi epoxy solder on ENEPIG-surface-finished PCB[J]. Journal of Electronic Materials, 2016, 45(11): 5895-5903.
[3] Estrine E C, Riemer S, Venkatasamy V, et al. Mechanism and stability study of gold electrodeposition from thiosulfate-sulfite solution[J]. Journal of The Electrochemical Society, 2014, 161(12): D687-D696.
[4] Green T A, Roy S. Speciation analysis of Au(I) electroplating baths containing sulfite and thiosulfate[J]. Journal of The Electrochemical Society, 2006, 153(3): C157-C163.
[5] Li B, Li N, Luo G, et al. Acceleration effect of Na₂S₂O₃on the immersion gold plating on Ni-P surface from a sulfite based electrolyte[J]. Surface and Coatings Technology, 2016, 302: 202-207.
[6] Wang Y, Cao X, Wang W, et al. Immersion gold deposition from a chloroauric acid-choline chloride solution: Deposition kinetics and coating performances[J]. Surface and Coatings Technology, 2015, 265: 62-67.
[7] Ballantyne A D, Forrest G C H, Frisch G, et al. Electrochemistry and speciation of Au⁺ in a deep eutectic solvent: Growth and morphology of galvanic immersion coatings[J]. Physical Chemistry Chemical Physics, 2015, 17(45): 30540-30550.
[8] Zeng K, Stierman R, Abbott D, et al. The root cause of Black Pad failure of solder joints with electroless Ni/immersion gold plating[J]. Journal of Metals, 2006, 58(6): 75-79.
[9] Liu H P, Li N, Bi S F. Effect of polyethylene imine on corrosion of electroless nickel substrates during immersion gold plating[J]. Rare Metal Materials and Engineering, 2009, 38(6): 1087-1090.
[10] Won Y S, Park S S, Lee J, et al. The pH effect on black spots in surface finish: Electroless nickel immersion gold[J]. Applied Surface Science, 2010, 257(1): 56-61.
[11] Protsenko V S, Kityk A A, Shaiderov D A, et al. Effect of water content on physicochemical properties and electrochemical behavior of ionic liquids containing choline chloride, ethylene glycol and hydrated nickel chloride[J]. Journal of Molecular Liquids, 2015, 212: 716-722.
[12] Abbott A P, El Ttaib K, Ryder K S, et al. Electrodeposition of nickel using eutectic based ionic liquids[J]. Transactions of the IMF, 2008, 86(4): 234-240.
[13] Wang Y, Liu H, Bi S, et al. Effects of organic additives on the immersion gold depositing from a sulfite-thiosulfate solution in an electroless nickel immersion gold process[J]. RSC Advances, 2016, 6(12): 9656-9662.

镍离子对中磷镍基体氯化胆碱无氰浸金表面的改善

Surface Ehancement of Nickel Ions on Cyanide Free Immersion Gold Deposited from a Chloroauric Acid-Choline Chloride Solution on Medium-Phosphorus Nickel

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