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Journal of Electrochemistry ›› 2005, Vol. 11 ›› Issue (1): 42-45.

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Study on the New Technique of Cu Micro-plating Based on Ceramics

GU Zhi-jun~   

  1. (*1),ZHAO Xiong-chao~(1,2),GUO Qi-long~1,HONG Yan-ping~1,DENG Qun-shan~(1,2),CHEN Ren-huan~1(1. Institute of Matter Structure Chinese Acadermy of Sciences,Corrosion Division,Xiamen361012,China,2.Graduate School of the Chinese Acadermy of Sciences,Beijing 100039, China
  • Received:2005-02-28 Revised:2005-02-28 Online:2005-02-28 Published:2005-02-28

Abstract: By combing the computer processing system (including the design of the line and the pattern, the choice of the scanning area and the treatment of the activation) with the electroless-plating technology, this article provides a new approach for the micro-plating based on the ceramics. The copper film based on ceramics with good properties can be obtained under the mild operating conditions. The line resolution is 35 μm and the wiring speed is 50 mm/s. The results had also showed that the quality of the copper plating is closely related to the roughness of the ceramic substrates.

Key words: Ceramic substrates, Computer management system, Micro-plating, Electroless copper plating

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